On November 12, Dr. Jinghui Li, General Manager of TFC Technology (SG) PTE. LTD.—a leading global provider of total optical device solutions and advanced optoelectronic packaging manufacturing services—was invited to speak at the Industry Focus Session on "Datacenter Optoelectronics Supply Chain: Opportunities and Challenges" during the IEEE Photonics Conference (IPC) in Singapore, where he exchanged insights on technological development paths with global industry elites.

As a highly influential professional gathering in the photonics sector, the conference brought together executives, experts, and research representatives from the global industrial chain, focusing on four core themes: semiconductor optoelectronics, optoelectronic design and packaging, opportunities and challenges in AI optoelectronics, and the prospects and hurdles of the datacenter optoelectronics supply chain. The event highlighted that the accelerating penetration of silicon photonics technology in datacenters is spawning new opportunities and challenges for the supply chain, while the horizontal scaling of optoelectronic networks is placing stringent demands on device performance, system integration, and supply chain collaboration. Forum participants conducted in-depth discussions on key links including optoelectronic integrated circuits, lasers, fiber array units, advanced packaging, and wafer-level testing, aiming to build industry consensus and address bottlenecks hindering supply chain development.

Moderated by Dr. Subal Sahni, Vice President of Photonics Engineering at Celestial AI, the datacenter optoelectronics supply chain forum featured representatives from institutions and enterprises such as Singapore’s Agency for Science, Technology and Research (A*STAR), POET Technologies, and Advantest Singapore. In his speech, Dr. Li leveraged TFC’s technological accumulation and global layout to highlight the company’s core products and solutions tailored for 1.6T optical module and CPO application scenarios—including supporting products for the EML/SiP architecture of 1.6T 2xDR4 optical modules, as well as the POSA and optical engine combined solution for the 1.6T 2xFR4 SiP architecture. He also pointed out that amid the explosion of AI computing power, 800G/1.6T optical modules are driving the evolution of core devices toward higher performance, making vertical integration and collaborative efficiency of the supply chain critical. Dr. Li shared TFC’s practices in delivering one-stop solutions to clients through full-chain autonomy in R&D, production, and delivery.

This appearance marks TFC’s second time taking the stage at a top-tier international optoelectronics event following ECOC 2025, further expanding the company’s global industry influence and fully demonstrating the high recognition of its technical strength and product solutions as a leader in the core optical communication device segment. Looking ahead, TFC will continue to deepen its focus on photonics technology, strengthen collaboration across the global industrial chain, and contribute to the high-quality development of the industry.